Semix engineers and manufactures advanced electronic components and semiconductor solutions for the aerospace, automotive, industrial, and consumer electronics sectors worldwide.
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3nmNode Size
2.4GHzClock Speed
99.8%Yield Rate
26+Years of Excellence
140+Global Clients
3,500+Products Delivered
ISO9001:2015 Certified
// Core Capabilities
What We Build
From wafer fabrication to system-level integration, Semix delivers end-to-end semiconductor solutions engineered to exacting tolerances.
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Wafer Fabrication
Sub-5nm lithography processes on 300mm wafers, delivering ultra-high density logic and memory semiconductor devices for advanced applications.
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IC Design & Testing
Full-cycle integrated circuit design from RTL to GDSII, with on-site probe testing, burn-in, and automated optical inspection.
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PCB Assembly
High-density surface mount and through-hole assembly lines with 0201 component placement accuracy and solder paste inspection.
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Power Electronics
SiC and GaN power modules rated up to 10kV for EV drivetrains, industrial converters, and renewable energy inverter systems.
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RF & Microwave
mmWave and sub-6GHz transceiver modules, LNA and PA designs for 5G infrastructure, radar, and satellite communication.
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Embedded Systems
Custom SoC and FPGA-based embedded platform design with real-time OS support, security enclaves, and hardware-root-of-trust.
CLEANROOM FAB — CLASS 10 ISO 4
// Manufacturing Excellence
World-Class Cleanroom Facilities
Our 85,000 sq ft Class 10 ISO 4 cleanroom facility in Montreal houses state-of-the-art photolithography, chemical vapor deposition, and ion implantation equipment. Zero-defect manufacturing protocols and inline metrology ensure every wafer meets stringent quality benchmarks.
▸ 300mm wafer processing capability
▸ ASML EUV lithography systems
▸ 24/7 automated material handling
▸ Real-time SPC and process control
// Markets Served
Industries We Power
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Aerospace
Rad-hard ICs and high-rel components for avionics and space applications.
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Automotive
AEC-Q100 qualified MCUs, sensors, and power modules for EV and ADAS.
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Industrial
Ruggedized controllers and IO modules for factory automation and robotics.
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Telecom / 5G
RF front-end modules and baseband processors for next-gen networks.
// About Semix
Built on Precision. Driven by Innovation.
Two decades of semiconductor engineering excellence from the heart of Montreal.
// Our Mission
Engineering Tomorrow's Electronics Today
Founded in 1998, Semix has grown from a small IC design consultancy into one of North America's premier semiconductor manufacturers, employing over 1,200 engineers, technicians, and specialists across three continents.
Our mission is to push the boundaries of what's possible in silicon — delivering components that power the next generation of electric vehicles, 5G infrastructure, industrial automation, and aerospace systems.
SEMIX HQ — MONTREAL
// Company History
Our Journey
1998
Company Founded
Semix incorporated in Montreal by Dr. Elena Marchetti and Robert Chen as a semiconductor design consultancy serving telecom clients.
2003
First Fab Facility
Opened our inaugural 20,000 sq ft fabrication facility in the Business District, achieving ISO 9001 certification within the first year.
2008
Automotive Expansion
Launched AEC-Q100 qualified product lines for automotive applications; secured first OEM supply contract with a major EV manufacturer.
2014
R&D Centre Opened
Established the Semix Advanced Research Centre (SARC), investing $40M in next-generation compound semiconductor research.
2017
GaN Power Division
Spun out the GaN Power Electronics division to address surging demand for wide-bandgap semiconductors in industrial and EV markets.
2019
5G RF Modules
Released the MX-5G mmWave front-end module series, entering into supply agreements with three major base-station manufacturers globally.
2022
Facility Expansion
Expanded Montreal headquarters to 85,000 sq ft and upgraded lithography to sub-5nm processes with ASML EUV tooling.
2025
3nm Node Launch
Achieved industry milestone with first 3nm production node, delivering record transistor density and power efficiency metrics.
// Leadership Team
Meet Our Experts
Dr. Elena Marchetti
CEO & Co-Founder
Robert Chen
CTO & Co-Founder
Dr. Priya Nair
VP of Process Engineering
Marcus Okafor
VP of Operations
// Core Values
What Drives Us
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Precision First
Every nanometer matters. We hold ourselves to tolerances that go beyond industry standards in every fab process.
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Relentless Innovation
We invest 14% of annual revenue in R&D — continuously pushing the boundaries of what semiconductor technology can achieve.
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Customer Trust
Long-term partnerships built on transparent communication, rigorous QC, and on-time delivery commitments we stand behind.
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Sustainability
Our facilities are 80% renewable-powered. We lead the industry in chemical reclamation and low-waste manufacturing protocols.
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Safety & Compliance
Full ITAR, RoHS, and REACH compliance. Our safety programs have maintained zero lost-time incidents for 7 consecutive years.
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Talent Development
We partner with McGill and Polytechnique Montréal to nurture the next generation of semiconductor engineers and scientists.
// Products
Our Product Portfolio
Advanced semiconductor solutions engineered for performance-critical applications.
// Logic & Processor ICs
Processing Intelligence
High-performance logic, microcontrollers, and SoC devices built on our proprietary 3–7nm CMOS processes.
LOGIC IC
MX Core-X Series
64-bit multi-core application processors with integrated NPU, targeting AI-at-the-edge, robotics, and industrial vision systems.
Process Node5nm CMOS
Max Frequency3.2 GHz
CoresUp to 16-core
TDP15–45W
MICROCONTROLLER
MX MCU-700 Series
Ultra-low-power 32-bit ARM Cortex-M based MCUs with integrated ADC, DAC, USB, and CAN-FD for automotive and IoT deployments.
ArchitectureARM Cortex-M7
Flash / RAM4MB / 1MB
Voltage Range1.7V – 3.6V
Temp Range-40°C to 125°C
FPGA / PROGRAMMABLE
MX Flex FPGA
High-density 7nm FPGA platform with hardened DSP blocks, PCIe Gen5 cores, and 112G SerDes for prototyping and production.
Logic Cells2M – 10M
DSP BlocksUp to 6,800
I/O Voltage1.0V – 3.3V
InterfacePCIe 5.0 x16
// Power Electronics
Power Conversion Modules
Silicon Carbide (SiC) and Gallium Nitride (GaN) power devices engineered for the highest efficiency and power density.
SiC POWER
MX-SiC 1200V MOSFET
3rd-generation SiC MOSFETs with ultra-low RDS(on) for traction inverter and onboard charger applications in EVs.
Breakdown Voltage1200V
RDS(on) @ 25°C7 mΩ
Qg Total62 nC
PackageTO-247-4 / D2PAK
GaN POWER
MX-GaN 650V HEMT
Enhancement-mode GaN HEMTs with integrated gate driver for high-frequency DC-DC conversion in data center PSUs and solar inverters.
Voltage650V
RDS(on)50 mΩ
Switching FreqUp to 2 MHz
Efficiency>99%
POWER MODULE
MX Tri-Phase 400A Module
Full three-phase SiC inverter power module in a compact baseplate package, rated for industrial motor drives and grid-tied inverters.
Rated Current400A
Blocking Voltage1700V
Package62mm Baseplate
Topology3-Phase Full Bridge
// RF, Sensors & Embedded
Connected & Sensing Solutions
RF / 5G
MX-5G mmWave FEM
28/39GHz 5G FR2 front-end module with integrated PA, LNA, and phase-shifter for beamforming antenna arrays in base stations and CPE.
Frequency Band24–43.5 GHz
TX Power26 dBm
NF (RX)2.8 dB
MEMS SENSOR
MX-MEMS IMU Series
6-DoF MEMS inertial measurement units with digital SPI/I²C interface for precision navigation, stabilization, and industrial measurement.
Gyro Range±2000 °/s
Accel Range±16g
Output RateUp to 8 kHz
EMBEDDED SOC
MX Edge AI SoC
Heterogeneous SoC combining RISC-V application cores, a dedicated neural processing unit, and industrial safety subsystem for smart edge devices.
A rigorous, tightly controlled 6-stage manufacturing pipeline ensures every Semix component meets the highest quality and performance standards.
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Wafer Prep
Polishing and cleaning of 300mm silicon or SiC substrate ingots to atomic-level surface quality.
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Lithography
EUV and DUV multi-patterning to define sub-5nm feature geometries on the wafer surface.
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Deposition
CVD, ALD, and PVD processes deposit gate dielectrics, metal interconnects, and isolation layers.
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Implantation
Precision ion implantation to dope source, drain, and well regions to exact carrier concentrations.
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Metrology & QC
Inline CD-SEM, overlay, and electrical wafer sort with 100% automated optical inspection.
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Packaging
Advanced flip-chip, BGA, and 2.5D/3D heterogeneous integration in fan-out wafer-level packages.
// Process Technology
Semix MX-3 Platform
Our flagship 3nm FinFET process node delivers a 35% performance improvement over the previous generation, with 40% lower active power consumption and 2× logic density improvement.
Process Node
3nm FinFET (GAAFET transition planned 2026)
Wafer Size
300mm diameter
Lithography
ASML NXE EUV + multi-patterning
Metal Layers
Up to 18 metal interconnect layers
Gate Pitch
48nm (min)
SRAM Bit Cell
0.021 µm²
Supply Voltage
0.65V – 0.85V (nominal)
Yield (Production)
>99.1%
// Performance Benchmarks
Node-Over-Node Gains
Logic Density Improvement2.0×
Performance Gain @ Iso-Power35%
Power Reduction @ Iso-Perf40%
SRAM Bit Cell Scaling–26%
Leakage Current Reduction50%
High-K Metal Gate (HKMG)
Hafnium-based high-κ gate dielectrics with TiN/TaN metal gate stacks enabling reduced gate leakage and improved transistor control.
Low-K Interconnect Dielectrics
Carbon-doped oxide ILD materials with k < 2.5 to minimize capacitive coupling and signal propagation delays in dense metal stacks.
// Research & Development
What We're Working On
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Gate-All-Around FET
Our GAAFET / nanosheet transistor program targets sub-2nm logic nodes for 2027, achieving superior electrostatic control over FinFET geometries.
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3D Heterogeneous Integration
Die stacking with copper hybrid bonding pitch <1µm, enabling memory-on-logic and chiplet-based disaggregated architectures with minimal IO energy.
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Diamond Substrate Power Devices
Exploratory program using synthetic diamond as a wide-bandgap substrate for ultra-high breakdown voltage power switches exceeding 20kV.
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Neuromorphic Computing
Phase-change memory and memristor crossbar arrays for in-memory inference acceleration, targeting 10× energy efficiency over GPU-based AI workloads.
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Photonic Integration
Silicon photonics co-integration for high-bandwidth optical interconnects on-die, breaking the copper bandwidth wall in HPC and AI accelerators.
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Quantum-Safe Cryptography
Hardware implementation of NIST PQC lattice-based algorithms (Kyber, Dilithium) in dedicated security co-processors for post-quantum resilience.
// Quality Assurance
Zero-Defect Quality System
Semix operates a closed-loop statistical process control system across all 600+ process steps. Every wafer lot is tracked with unique identifiers through fully automated material-handling systems.
Automated Optical Inspection (AOI)
100% surface inspection at every critical layer using brightfield, darkfield, and confocal imaging with AI-based defect classification.
Electrical Wafer Sort (EWS)
Full parametric and functional testing at wafer level using over 2,400 test structures and production-matched test vectors.
Burn-In & Reliability Screening
HTOL, LTOL, and HAST reliability screening per JEDEC standards to screen out infant mortality and ensure long-term field reliability.
SEMIX QA LAB — ISO CLASS 5
// Contact Us
Get in Touch
Sales inquiries, technical support, partnership opportunities — we're here to help.
// Headquarters
Semix Montreal
Our global headquarters is located in the heart of Montreal's Business District. We welcome on-site visits for qualified customers and partners — please contact us to schedule a facility tour.
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Address
Building 5192, Avenue Road, Apt 853 Business District, Financial Quarter Montreal, NU H0G 1H8, Canada
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Phone
+1-278-455-7824
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Email
info@semix.ca sales@semix.ca
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Business Hours
Monday – Friday: 8:00 AM – 6:00 PM EST Saturday: 9:00 AM – 1:00 PM EST
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Facility
85,000 sq ft · ISO Class 4 Cleanroom 300mm Wafer Fab · Montreal, QC
Send Us a Message
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// Departments
Contact the Right Team
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Sales
Product quotes, pricing, and order placement.
sales@semix.ca
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Technical
Application engineering, datasheets, and design support.
support@semix.ca
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Foundry
Custom process development and wafer fab services.
foundry@semix.ca
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Partners
Distribution partnerships and supply chain agreements.
CLEANROOM FAB — CLASS 10 ISO 4
